• Compatible with FR-4 fabrication processes
  • Well controlled dielectric constants (Dk)
  • Above-average thermal conductivity (.6-.8)
  • Thermally robust - lead free soldering compatibility
  • Low Z-axis CTE for reliable plated through-hole quality
  • Optimized cost and RF/ microwave performance
  • Wide range of DK available (2.55-6.15)
  • UL 94 V-0 flame retardant versions available


RO4000® LoPro® Laminates

  • Allows reverse treated foil to bond to standard RO4000® dielectric
  • Low DK loss for higher operating frequency designs
  • Reduced passive intermodulation (PIM) performance

RO4003C™ Laminates

  • Original RO4000® material, used in cost sensitive Microwave/RF designs
  • Dk of 3.38 (+/-0.05)
  • Dissipating factor of 0.0027 at 10 GHz is lowest dielectric loss of R04000® product family

RO4350B™ Laminates

  • Market leading material for base station power amplifier designs
  • UL 94 V-0 rated
  • Dk of 3.48 (+/-0.05)
  • Df 0.0037 at 10 GHz

RO4360G2™ Laminates

  • RoHS certified
  • Low Z-axis CTE
  • Dk 6.15 (+/- 0.015)
  • Dissipating factor of 0.0038 at 10 GHz

RO4400™/RO4400T™ Series Bondply

  • Prepreg family based on RO4000 series core materials.
  • Sequential lamination capable
  • Lead free soldering capable
  • Thinner options for improved multilayer design flexibility

RO4500™ Laminates

  • Commercial antenna grade series for high volume designs
  • Excellent mechanical rigidity for efficient and reliable installation
  • Improved PIM when used with LoPro™ copper

RO4700™ Antenna Grade Laminates

  • First RO4000® low Dk antenna grade material available
  • Dk 2.55 (+/- 0.05) or 3.0 (+/- 0.05)
  • Df 0.0022 at 2.5 GHz or 0.0023 at 2.5 GHz, respectively

RO4830™ Laminates

  • Low cost solution for millimeter wave patch antenna designs
  • Insertion loss similar to RO3003™ laminate with standard ED copper at 77GHz
  • Spread glass to minimize Dk variation

RO4835™ Laminates

  • 10x oxidation resistance compared to traditional thermoset laminates
  • Dk 3.48(+/-0.05)
  • Df 0.0037 at 10GHz

RO4835IND™ LoPro® Laminates

  • RF laminates for 60 to 81 GHz industrial radar applications
  • Low insertion loss from LoPro® reverse treated copper foil
  • Reliable RF and mechanical performance

RO4835T™ Laminates

  • Thin offerings of the RO4835™ Laminates
  • Spread glass minimizes Dk variation

CU4000™ and CU4000 LoPro® Foil

  • IPC-4562A Grade 3, High Temperature Elongation Foil
  • Enables foil lamination of RO4000 Multilayer PCB
  • Simplifies Multilayer PCB registration


Explore our calculators, conversion tools, technical papers and more.


Samples can be requested through our online request system.

Sample Requests


Advanced Electronics Solutions

Find local representatives for personalized support.